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Advanced Metallization Conference 2008 (AMC 2008): Volume 24
Hardback
Main Details
Title |
Advanced Metallization Conference 2008 (AMC 2008): Volume 24
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Authors and Contributors |
Edited by Mehul Naik
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Edited by Roey Shaviv
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Edited by Takashi Yoda
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Edited by Kazuyoshi Ueno
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Series | MRS Conference Proceedings |
Physical Properties |
Format:Hardback | Pages:769 | Dimensions(mm): Height 235,Width 158 |
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Category/Genre | Materials science |
ISBN/Barcode |
9781605111254
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Audience | Professional & Vocational | |
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Publishing Details |
Publisher |
Materials Research Society
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Imprint |
Materials Research Society
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Publication Date |
1 January 2009 |
Publication Country |
United States
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Description
The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
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