Advanced Metallization Conference 2008 (AMC 2008): Volume 24

Hardback

Main Details

Title Advanced Metallization Conference 2008 (AMC 2008): Volume 24
Authors and Contributors      Edited by Mehul Naik
Edited by Roey Shaviv
Edited by Takashi Yoda
Edited by Kazuyoshi Ueno
SeriesMRS Conference Proceedings
Physical Properties
Format:Hardback
Pages:769
Dimensions(mm): Height 235,Width 158
Category/GenreMaterials science
ISBN/Barcode 9781605111254
Audience
Professional & Vocational

Publishing Details

Publisher Materials Research Society
Imprint Materials Research Society
Publication Date 1 January 2009
Publication Country United States

Description

The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.