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Chemical-Mechanical Planarization: Volume 767
Hardback
Main Details
| Title |
Chemical-Mechanical Planarization: Volume 767
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| Authors and Contributors |
Edited by Duane S. Boning
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Edited by Katia Devriendt
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Edited by Michael R. Oliver
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Edited by David J. Stein
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Edited by Ingrid Vos
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| Series | MRS Proceedings |
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| Physical Properties |
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| Category/Genre | Materials science |
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| ISBN/Barcode |
9781558997042
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| Classifications | Dewey:621.3815 |
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| Audience | | Professional & Vocational | |
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| Illustrations |
Worked examples or Exercises
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Publishing Details |
| Publisher |
Materials Research Society
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| Imprint |
Materials Research Society
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| Publication Date |
27 August 2003 |
| Publication Country |
United States
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Description
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.
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