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Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612
Paperback / softback
Main Details
| Title |
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612
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| Authors and Contributors |
Edited by G. S. Oehrlein
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Edited by K. Maex
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Edited by Y. -C. Joo
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Edited by S. Ogawa
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Edited by J. T. Wetzel
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| Series | MRS Proceedings |
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| Physical Properties |
| Format:Paperback / softback | | Pages:614 | | Dimensions(mm): Height 229,Width 152 |
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| Category/Genre | Technology - general issues
Materials science |
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| ISBN/Barcode |
9781107413153
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| Classifications | Dewey:620.00452 |
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| Audience | | Postgraduate, Research & Scholarly | | Professional & Vocational | |
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Publishing Details |
| Publisher |
Cambridge University Press
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| Imprint |
Cambridge University Press
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| Publication Date |
5 June 2014 |
| Publication Country |
United Kingdom
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Description
This book highlights important achievements and challenges in advanced interconnects and low-k dielectrics as employed in the microelectronics industry. The replacement of Al alloys with Cu along with the introduction of new barrier materials to protect Cu from chemical attack, and the utilization of new dielectric materials with a lower relative dielectric constant k than SiO2 in multilevel metallization structures of increasing complexity, are the major themes of evolution in this field. Invited reviews illustrate the significant progress that has been achieved as well as the challenges that remain. Contributed papers presented by researchers from different countries demonstrate progress on current topics using a truly multidisciplinary approach.
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