To view prices and purchase online, please login or create an account now.



Integration Techniques for Micro/Nanostructure-based Large-Area Electronics

Paperback / softback

Main Details

Title Integration Techniques for Micro/Nanostructure-based Large-Area Electronics
Authors and Contributors      By (author) Carlos Garcia Nunez
By (author) Fengyuan Liu
By (author) Sheng Xu
By (author) Ravinder Dahiya
SeriesElements in Flexible and Large-Area Electronics
Physical Properties
Format:Paperback / softback
Pages:75
Dimensions(mm): Height 230,Width 150
ISBN/Barcode 9781108703529
ClassificationsDewey:620.115
Audience
Professional & Vocational
Illustrations Worked examples or Exercises; 24 Halftones, black and white

Publishing Details

Publisher Cambridge University Press
Imprint Cambridge University Press
Publication Date 8 November 2018
Publication Country United Kingdom

Description

Advanced nanostructured materials such as organic and inorganic micro/nanostructures are excellent building blocks for electronics, optoelectronics, sensing, and photovoltaics because of their high-crystallinity, long aspect-ratio, high surface-to-volume ratio, and low dimensionality. However, their assembly over large areas and integration in functional circuits are a matter of intensive investigation. This Element provides detailed description of various technologies to realize micro/nanostructures based large-area electronics (LAE) devices on rigid or flexible/stretchable substrates. The first section of this Element provides an introduction to the state-of-the-art integration techniques used to fabricate LAE devices based on different kind of micro/nanostructures. The second section describes inorganic and organic micro/nanostructures, including most common and promising synthesis procedures. In the third section,different techniques are explained that have great potential for integration of micro/nanostructures over large areas. Finally, the fourth section summarizes important remarks about LAE devices based on micro/nanostructures, and future directions.