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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156

Paperback / softback

Main Details

Title Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156
Authors and Contributors      Edited by Martin Gall
Edited by Alfred Grill
Edited by Francesca Lacopi
Edited by Junichi Koike
Edited by Takamasa Usui
SeriesMRS Proceedings
Physical Properties
Format:Paperback / softback
Pages:204
Dimensions(mm): Height 229,Width 152
Category/GenreMaterials science
ISBN/Barcode 9781107408319
ClassificationsDewey:620.115
Audience
Postgraduate, Research & Scholarly
Professional & Vocational

Publishing Details

Publisher Cambridge University Press
Imprint Cambridge University Press
Publication Date 5 June 2014
Publication Country United Kingdom

Description

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.